Curing Oven
Inquire productC1-003
Industrial Curing Ovens are used by thermal processing specialists to improve the strength and durability of a material by applying heat to accelerate a desirable chemical reaction.
Usage: semiconductor packaging program segment, for resin curing
Available in 2/4/6-chamber combinations (independent control for each chamber).
Space saving.
Horizontal convection.
Fast temperature rising and cooling, with program operation function.
Equipped with auto lock, N2 flowmeter, temperature recorder, emergency stop switch, etc.
Equipped with safety devices of auto overheat protector, overheat protector, abnormal N2 pressure, abnormal N2 flow, over-current earth leakage circuit breaker, etc.
- Applications
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- - semiconductor packaging program segment, for resin curing
- Technical specifications
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C1-003 Operating temperature range40~260°CTemperature adjustment accuracy±5.0°C (at 175°C)Temperature rising time15 min (50°C→175°C)Temperature cooling time30min (175°C→50°C)Operation functionFixed temp., program operationConfigurationAir exhaust actuator, N2 introduction device, recorder, etc.Internal dimension (WxDxH) - single chamber450 mm x 520 mm x 300 mmPower source3 phase AC380V 6A
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